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Solder Alloy 122 vs. Solder Alloy 811

Both solder alloy 122 and solder alloy 811 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. There are 23 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is solder alloy 122 and the bottom bar is solder alloy 811.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 20
52
Elongation at Break, % 30
38
Poisson's Ratio 0.43
0.35
Shear Modulus, GPa 6.9
19
Tensile Strength: Ultimate (UTS), MPa 30
53

Thermal Properties

Latent Heat of Fusion, J/g 27
63
Melting Completion (Liquidus), °C 300
200
Melting Onset (Solidus), °C 270
190
Specific Heat Capacity, J/kg-K 140
230
Thermal Conductivity, W/m-K 25
59
Thermal Expansion, µm/m-K 28
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.9
14
Electrical Conductivity: Equal Weight (Specific), % IACS 7.3
17

Otherwise Unclassified Properties

Density, g/cm3 11
7.3
Embodied Carbon, kg CO2/kg material 5.0
14
Embodied Energy, MJ/kg 84
240
Embodied Water, L/kg 540
1200

Common Calculations

Stiffness to Weight: Axial, points 1.0
4.0
Stiffness to Weight: Bending, points 8.2
17
Strength to Weight: Axial, points 0.77
2.0
Strength to Weight: Bending, points 2.0
4.3
Thermal Diffusivity, mm2/s 17
35
Thermal Shock Resistance, points 3.9
3.3

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.25
2.8 to 3.2
Cadmium (Cd), % 0 to 0.0050
0 to 0.0020
Copper (Cu), % 0 to 0.080
0 to 0.050
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 88.4 to 90.5
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 9.5 to 10.5
87.8 to 89.7
Zinc (Zn), % 0 to 0.0010
7.5 to 8.5