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Solder Alloy 181 vs. C72150 Copper-nickel

Solder alloy 181 belongs to the otherwise unclassified metals classification, while C72150 copper-nickel belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 181 and the bottom bar is C72150 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 18
150
Elongation at Break, % 41
29
Poisson's Ratio 0.44
0.33
Shear Modulus, GPa 6.1
55
Tensile Strength: Ultimate (UTS), MPa 27
490

Thermal Properties

Latent Heat of Fusion, J/g 26
250
Melting Completion (Liquidus), °C 310
1210
Melting Onset (Solidus), °C 300
1250
Specific Heat Capacity, J/kg-K 130
410
Thermal Conductivity, W/m-K 24
22
Thermal Expansion, µm/m-K 29
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.3
3.5
Electrical Conductivity: Equal Weight (Specific), % IACS 7.4
3.6

Otherwise Unclassified Properties

Density, g/cm3 11
8.9
Embodied Carbon, kg CO2/kg material 6.2
6.1
Embodied Energy, MJ/kg 100
88

Common Calculations

Stiffness to Weight: Axial, points 0.86
9.1
Stiffness to Weight: Bending, points 7.7
20
Strength to Weight: Axial, points 0.66
15
Strength to Weight: Bending, points 1.8
15
Thermal Diffusivity, mm2/s 16
6.0
Thermal Shock Resistance, points 3.8
18

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.2
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Carbon (C), % 0
0 to 0.1
Copper (Cu), % 0 to 0.080
52.5 to 57
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.1
Lead (Pb), % 96.2 to 98
0 to 0.050
Manganese (Mn), % 0
0 to 0.050
Nickel (Ni), % 0 to 0.010
43 to 46
Silicon (Si), % 0
0 to 0.5
Silver (Ag), % 2.0 to 3.0
0
Tin (Sn), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.0010
0 to 0.2
Residuals, % 0
0 to 0.5