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Solder Alloy 301 vs. C12600 Copper

Solder alloy 301 belongs to the otherwise unclassified metals classification, while C12600 copper belongs to the copper alloys. There are 25 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 301 and the bottom bar is C12600 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 40
120
Elongation at Break, % 51
56
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 15
56
Tensile Strength: Ultimate (UTS), MPa 55
270
Tensile Strength: Yield (Proof), MPa 49
69

Thermal Properties

Latent Heat of Fusion, J/g 55
210
Melting Completion (Liquidus), °C 140
1080
Melting Onset (Solidus), °C 140
1030
Specific Heat Capacity, J/kg-K 160
390
Thermal Conductivity, W/m-K 19
130
Thermal Expansion, µm/m-K 14
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.7
29
Electrical Conductivity: Equal Weight (Specific), % IACS 4.9
29

Otherwise Unclassified Properties

Density, g/cm3 8.7
8.9
Embodied Carbon, kg CO2/kg material 13
2.6
Embodied Energy, MJ/kg 210
41

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 27
110
Resilience: Unit (Modulus of Resilience), kJ/m3 30
21
Stiffness to Weight: Axial, points 2.5
7.2
Stiffness to Weight: Bending, points 13
18
Strength to Weight: Axial, points 1.8
8.2
Strength to Weight: Bending, points 3.7
10
Thermal Diffusivity, mm2/s 13
39
Thermal Shock Resistance, points 7.2
9.5

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 56.5 to 59
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
99.5 to 99.8
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
0.2 to 0.4
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 41 to 43
0
Zinc (Zn), % 0 to 0.0010
0