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Solder Alloy 401 vs. Solder Alloy 501

Both solder alloy 401 and solder alloy 501 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. Their average alloy composition is basically identical.

For each property being compared, the top bar is solder alloy 401 and the bottom bar is solder alloy 501.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 9.0
14
Elastic (Young's, Tensile) Modulus, GPa 50
51
Elongation at Break, % 21
22
Poisson's Ratio 0.36
0.36
Shear Modulus, GPa 19
19
Tensile Strength: Ultimate (UTS), MPa 29
29

Thermal Properties

Latent Heat of Fusion, J/g 60
60
Melting Completion (Liquidus), °C 230
230
Melting Onset (Solidus), °C 230
220
Specific Heat Capacity, J/kg-K 220
220
Thermal Conductivity, W/m-K 66
67
Thermal Expansion, µm/m-K 22
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
14
Electrical Conductivity: Equal Weight (Specific), % IACS 17
17

Otherwise Unclassified Properties

Density, g/cm3 7.3
7.3
Embodied Carbon, kg CO2/kg material 15
15
Embodied Energy, MJ/kg 250
260
Embodied Water, L/kg 1200
1390

Common Calculations

Stiffness to Weight: Axial, points 3.8
3.8
Stiffness to Weight: Bending, points 17
17
Strength to Weight: Axial, points 1.1
1.1
Strength to Weight: Bending, points 2.9
2.9
Thermal Diffusivity, mm2/s 40
41
Thermal Shock Resistance, points 1.9
1.9

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.060
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0.5 to 0.9
0.5 to 0.9
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0.2 to 0.4
Tin (Sn), % 98.5 to 99.5
98.3 to 99.3
Zinc (Zn), % 0 to 0.0010
0 to 0.0010