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Solder Alloy 501 vs. CC767S Brass

Solder alloy 501 belongs to the otherwise unclassified metals classification, while CC767S brass belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 501 and the bottom bar is CC767S brass.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 14
86
Elastic (Young's, Tensile) Modulus, GPa 51
110
Elongation at Break, % 22
34
Poisson's Ratio 0.36
0.31
Shear Modulus, GPa 19
40
Tensile Strength: Ultimate (UTS), MPa 29
430

Thermal Properties

Latent Heat of Fusion, J/g 60
180
Melting Completion (Liquidus), °C 230
840
Melting Onset (Solidus), °C 220
790
Specific Heat Capacity, J/kg-K 220
390
Thermal Conductivity, W/m-K 67
110
Thermal Expansion, µm/m-K 22
21

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
32
Electrical Conductivity: Equal Weight (Specific), % IACS 17
36

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.0
Embodied Carbon, kg CO2/kg material 15
2.7
Embodied Energy, MJ/kg 260
47
Embodied Water, L/kg 1390
330

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.3
Stiffness to Weight: Bending, points 17
20
Strength to Weight: Axial, points 1.1
15
Strength to Weight: Bending, points 2.9
16
Thermal Diffusivity, mm2/s 41
34
Thermal Shock Resistance, points 1.9
14

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0.1 to 0.8
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.060
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0.5 to 0.9
58 to 64
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.5
Lead (Pb), % 0 to 0.070
0 to 0.1
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
0 to 1.0
Silicon (Si), % 0
0 to 0.2
Silver (Ag), % 0.2 to 0.4
0
Tin (Sn), % 98.3 to 99.3
0 to 0.1
Zinc (Zn), % 0 to 0.0010
32.8 to 41.9