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Solder Alloy 501 vs. Solder Alloy 401

Both solder alloy 501 and solder alloy 401 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. Their average alloy composition is basically identical.

For each property being compared, the top bar is solder alloy 501 and the bottom bar is solder alloy 401.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 14
9.0
Elastic (Young's, Tensile) Modulus, GPa 51
50
Elongation at Break, % 22
21
Poisson's Ratio 0.36
0.36
Shear Modulus, GPa 19
19
Tensile Strength: Ultimate (UTS), MPa 29
29

Thermal Properties

Latent Heat of Fusion, J/g 60
60
Melting Completion (Liquidus), °C 230
230
Melting Onset (Solidus), °C 220
230
Specific Heat Capacity, J/kg-K 220
220
Thermal Conductivity, W/m-K 67
66
Thermal Expansion, µm/m-K 22
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
14
Electrical Conductivity: Equal Weight (Specific), % IACS 17
17

Otherwise Unclassified Properties

Density, g/cm3 7.3
7.3
Embodied Carbon, kg CO2/kg material 15
15
Embodied Energy, MJ/kg 260
250
Embodied Water, L/kg 1390
1200

Common Calculations

Stiffness to Weight: Axial, points 3.8
3.8
Stiffness to Weight: Bending, points 17
17
Strength to Weight: Axial, points 1.1
1.1
Strength to Weight: Bending, points 2.9
2.9
Thermal Diffusivity, mm2/s 41
40
Thermal Shock Resistance, points 1.9
1.9

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.060
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0.5 to 0.9
0.5 to 0.9
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0.2 to 0.4
0 to 0.1
Tin (Sn), % 98.3 to 99.3
98.5 to 99.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010