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Solder Alloy 501 vs. Solder Alloy 801

Both solder alloy 501 and solder alloy 801 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have a moderately high 91% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 501 and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 14
22
Elastic (Young's, Tensile) Modulus, GPa 51
53
Elongation at Break, % 22
33
Poisson's Ratio 0.36
0.35
Shear Modulus, GPa 19
20
Tensile Strength: Ultimate (UTS), MPa 29
55

Thermal Properties

Latent Heat of Fusion, J/g 60
64
Melting Completion (Liquidus), °C 230
200
Melting Onset (Solidus), °C 220
200
Specific Heat Capacity, J/kg-K 220
240
Thermal Conductivity, W/m-K 67
61
Thermal Expansion, µm/m-K 22
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
15
Electrical Conductivity: Equal Weight (Specific), % IACS 17
19

Otherwise Unclassified Properties

Density, g/cm3 7.3
7.2
Embodied Carbon, kg CO2/kg material 15
14
Embodied Energy, MJ/kg 260
240
Embodied Water, L/kg 1390
1140

Common Calculations

Stiffness to Weight: Axial, points 3.8
4.1
Stiffness to Weight: Bending, points 17
17
Strength to Weight: Axial, points 1.1
2.1
Strength to Weight: Bending, points 2.9
4.4
Thermal Diffusivity, mm2/s 41
36
Thermal Shock Resistance, points 1.9
3.3

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.060
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0.5 to 0.9
0 to 0.050
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0.2 to 0.4
0 to 0.1
Tin (Sn), % 98.3 to 99.3
89.9 to 91.5
Zinc (Zn), % 0 to 0.0010
8.5 to 9.5