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Solder Alloy 601 vs. Solder Alloy 811

Both solder alloy 601 and solder alloy 811 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 48% of their average alloy composition in common. There are 21 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is solder alloy 601 and the bottom bar is solder alloy 811.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 31
52
Elongation at Break, % 83
38
Poisson's Ratio 0.41
0.35
Shear Modulus, GPa 11
19
Tensile Strength: Ultimate (UTS), MPa 12
53

Thermal Properties

Latent Heat of Fusion, J/g 43
63
Melting Completion (Liquidus), °C 120
200
Melting Onset (Solidus), °C 120
190
Specific Heat Capacity, J/kg-K 230
230
Thermal Conductivity, W/m-K 34
59
Thermal Expansion, µm/m-K 23
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
14
Electrical Conductivity: Equal Weight (Specific), % IACS 14
17

Otherwise Unclassified Properties

Density, g/cm3 7.3
7.3
Embodied Water, L/kg 1330
1200

Common Calculations

Stiffness to Weight: Axial, points 2.3
4.0
Stiffness to Weight: Bending, points 14
17
Strength to Weight: Axial, points 0.45
2.0
Strength to Weight: Bending, points 1.6
4.3
Thermal Diffusivity, mm2/s 20
35
Thermal Shock Resistance, points 1.2
3.3

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
2.8 to 3.2
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0 to 0.050
0 to 0.050
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 51 to 52.5
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 47.5 to 48.5
87.8 to 89.7
Zinc (Zn), % 0 to 0.0010
7.5 to 8.5