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Solder Alloy 704 vs. Solder Alloy 181

Both solder alloy 704 and solder alloy 181 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. There are 22 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is solder alloy 704 and the bottom bar is solder alloy 181.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
18
Elongation at Break, % 30
41
Poisson's Ratio 0.36
0.44
Shear Modulus, GPa 19
6.1
Tensile Strength: Ultimate (UTS), MPa 55
27

Thermal Properties

Latent Heat of Fusion, J/g 62
26
Melting Completion (Liquidus), °C 240
310
Melting Onset (Solidus), °C 220
300
Specific Heat Capacity, J/kg-K 220
130
Thermal Conductivity, W/m-K 50
24
Thermal Expansion, µm/m-K 22
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 13
9.3
Electrical Conductivity: Equal Weight (Specific), % IACS 15
7.4

Otherwise Unclassified Properties

Density, g/cm3 7.5
11
Embodied Carbon, kg CO2/kg material 19
6.2
Embodied Energy, MJ/kg 320
100

Common Calculations

Stiffness to Weight: Axial, points 3.8
0.86
Stiffness to Weight: Bending, points 17
7.7
Strength to Weight: Axial, points 2.1
0.66
Strength to Weight: Bending, points 4.3
1.8
Thermal Diffusivity, mm2/s 30
16
Thermal Shock Resistance, points 3.5
3.8

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.2
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0 to 0.050
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
96.2 to 98
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 4.8 to 5.2
2.0 to 3.0
Tin (Sn), % 94.3 to 95.2
0 to 0.25
Zinc (Zn), % 0 to 0.0010
0 to 0.0010