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Solder Alloy 811 vs. Solder Alloy 112

Both solder alloy 811 and solder alloy 112 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 50% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 811 and the bottom bar is solder alloy 112.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 52
33
Elongation at Break, % 38
35
Poisson's Ratio 0.35
0.4
Shear Modulus, GPa 19
12
Tensile Strength: Ultimate (UTS), MPa 53
41

Thermal Properties

Latent Heat of Fusion, J/g 63
41
Melting Completion (Liquidus), °C 200
220
Melting Onset (Solidus), °C 190
180
Specific Heat Capacity, J/kg-K 230
180
Thermal Conductivity, W/m-K 59
49
Thermal Expansion, µm/m-K 22
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
11
Electrical Conductivity: Equal Weight (Specific), % IACS 17
10

Otherwise Unclassified Properties

Density, g/cm3 7.3
9.3
Embodied Carbon, kg CO2/kg material 14
9.4
Embodied Energy, MJ/kg 240
160
Embodied Water, L/kg 1200
830

Common Calculations

Stiffness to Weight: Axial, points 4.0
2.0
Stiffness to Weight: Bending, points 17
11
Strength to Weight: Axial, points 2.0
1.2
Strength to Weight: Bending, points 4.3
2.8
Thermal Diffusivity, mm2/s 35
30
Thermal Shock Resistance, points 3.3
3.5

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.050
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 2.8 to 3.2
0 to 0.050
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0 to 0.050
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
49 to 50.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 87.8 to 89.7
49.5 to 50.5
Zinc (Zn), % 7.5 to 8.5
0 to 0.0010