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Solder Alloy 811 vs. Solder Alloy 113

Both solder alloy 811 and solder alloy 113 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 45% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 811 and the bottom bar is solder alloy 113.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 52
32
Elongation at Break, % 38
32
Poisson's Ratio 0.35
0.4
Shear Modulus, GPa 19
11
Tensile Strength: Ultimate (UTS), MPa 53
39

Thermal Properties

Latent Heat of Fusion, J/g 63
40
Melting Completion (Liquidus), °C 200
230
Melting Onset (Solidus), °C 190
180
Specific Heat Capacity, J/kg-K 230
170
Thermal Conductivity, W/m-K 59
46
Thermal Expansion, µm/m-K 22
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
10
Electrical Conductivity: Equal Weight (Specific), % IACS 17
9.8

Otherwise Unclassified Properties

Density, g/cm3 7.3
9.5
Embodied Carbon, kg CO2/kg material 14
8.9
Embodied Energy, MJ/kg 240
150
Embodied Water, L/kg 1200
800

Common Calculations

Stiffness to Weight: Axial, points 4.0
1.8
Stiffness to Weight: Bending, points 17
11
Strength to Weight: Axial, points 2.0
1.1
Strength to Weight: Bending, points 4.3
2.7
Thermal Diffusivity, mm2/s 35
28
Thermal Shock Resistance, points 3.3
3.4

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 2.8 to 3.2
0 to 0.25
Cadmium (Cd), % 0 to 0.0020
0 to 0.0050
Copper (Cu), % 0 to 0.050
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
53.4 to 55.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 87.8 to 89.7
44.5 to 45.5
Zinc (Zn), % 7.5 to 8.5
0 to 0.0010