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Solder Alloy 811 vs. Solder Alloy 121

Both solder alloy 811 and solder alloy 121 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. There are 23 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is solder alloy 811 and the bottom bar is solder alloy 121.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 52
21
Elongation at Break, % 38
25
Poisson's Ratio 0.35
0.43
Shear Modulus, GPa 19
7.5
Tensile Strength: Ultimate (UTS), MPa 53
32

Thermal Properties

Latent Heat of Fusion, J/g 63
29
Melting Completion (Liquidus), °C 200
290
Melting Onset (Solidus), °C 190
230
Specific Heat Capacity, J/kg-K 230
140
Thermal Conductivity, W/m-K 59
31
Thermal Expansion, µm/m-K 22
28

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 17
7.4

Otherwise Unclassified Properties

Density, g/cm3 7.3
11
Embodied Carbon, kg CO2/kg material 14
5.6
Embodied Energy, MJ/kg 240
93
Embodied Water, L/kg 1200
580

Common Calculations

Stiffness to Weight: Axial, points 4.0
1.1
Stiffness to Weight: Bending, points 17
8.6
Strength to Weight: Axial, points 2.0
0.84
Strength to Weight: Bending, points 4.3
2.1
Thermal Diffusivity, mm2/s 35
20
Thermal Shock Resistance, points 3.3
3.9

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 2.8 to 3.2
0 to 0.25
Cadmium (Cd), % 0 to 0.0020
0 to 0.0050
Copper (Cu), % 0 to 0.050
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
83.4 to 85.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 87.8 to 89.7
14.5 to 15.5
Zinc (Zn), % 7.5 to 8.5
0 to 0.0010