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Solder Alloy 811 vs. Solder Alloy 702

Both solder alloy 811 and solder alloy 702 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 89% of their average alloy composition in common. There are 22 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is solder alloy 811 and the bottom bar is solder alloy 702.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 52
51
Elongation at Break, % 38
21
Poisson's Ratio 0.35
0.36
Shear Modulus, GPa 19
19
Tensile Strength: Ultimate (UTS), MPa 53
53

Thermal Properties

Latent Heat of Fusion, J/g 63
61
Melting Completion (Liquidus), °C 200
220
Melting Onset (Solidus), °C 190
220
Specific Heat Capacity, J/kg-K 230
220
Thermal Conductivity, W/m-K 59
62
Thermal Expansion, µm/m-K 22
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
15
Electrical Conductivity: Equal Weight (Specific), % IACS 17
18

Otherwise Unclassified Properties

Density, g/cm3 7.3
7.4
Embodied Carbon, kg CO2/kg material 14
17
Embodied Energy, MJ/kg 240
290

Common Calculations

Stiffness to Weight: Axial, points 4.0
3.8
Stiffness to Weight: Bending, points 17
17
Strength to Weight: Axial, points 2.0
2.0
Strength to Weight: Bending, points 4.3
4.2
Thermal Diffusivity, mm2/s 35
38
Thermal Shock Resistance, points 3.3
3.4

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 2.8 to 3.2
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0 to 0.050
0 to 0.050
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
2.8 to 3.2
Tin (Sn), % 87.8 to 89.7
96.3 to 97.2
Zinc (Zn), % 7.5 to 8.5
0 to 0.0010