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H55 C10500 Copper vs. H55 C70400 Copper-nickel

Both H55 C10500 copper and H55 C70400 copper-nickel are copper alloys. Both are furnished in the H55 (light drawn) temper. They have a moderately high 92% of their average alloy composition in common. There are 26 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is H55 C10500 copper and the bottom bar is H55 C70400 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 43
45
Tensile Strength: Ultimate (UTS), MPa 280
310
Tensile Strength: Yield (Proof), MPa 240
230

Thermal Properties

Latent Heat of Fusion, J/g 210
210
Maximum Temperature: Mechanical, °C 200
210
Melting Completion (Liquidus), °C 1080
1120
Melting Onset (Solidus), °C 1080
1060
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 390
64
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
14
Electrical Conductivity: Equal Weight (Specific), % IACS 100
14

Otherwise Unclassified Properties

Base Metal Price, % relative 32
32
Density, g/cm3 9.0
8.9
Embodied Carbon, kg CO2/kg material 2.6
3.0
Embodied Energy, MJ/kg 42
47
Embodied Water, L/kg 350
300

Common Calculations

Resilience: Unit (Modulus of Resilience), kJ/m3 250
220
Stiffness to Weight: Axial, points 7.2
7.5
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 8.6
9.8
Strength to Weight: Bending, points 11
12
Thermal Diffusivity, mm2/s 110
18
Thermal Shock Resistance, points 9.8
11

Alloy Composition


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Copper (Cu), % 99.89 to 99.966
89.8 to 93.6
Iron (Fe), % 0
1.3 to 1.7
Lead (Pb), % 0
0 to 0.050
Manganese (Mn), % 0
0.3 to 0.8
Nickel (Ni), % 0
4.8 to 6.2
Oxygen (O), % 0 to 0.0010
0
Silver (Ag), % 0.034 to 0.060
0
Zinc (Zn), % 0
0 to 1.0
Residuals, % 0 to 0.050
0 to 0.5