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H55 C10500 Copper vs. H55 C70600 Copper-nickel

Both H55 C10500 copper and H55 C70600 copper-nickel are copper alloys. Both are furnished in the H55 (light drawn) temper. They have 87% of their average alloy composition in common. There are 27 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is H55 C10500 copper and the bottom bar is H55 C70600 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 43
46
Tensile Strength: Ultimate (UTS), MPa 280
350
Tensile Strength: Yield (Proof), MPa 240
270

Thermal Properties

Latent Heat of Fusion, J/g 210
220
Maximum Temperature: Mechanical, °C 200
220
Melting Completion (Liquidus), °C 1080
1150
Melting Onset (Solidus), °C 1080
1100
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 390
44
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
9.8
Electrical Conductivity: Equal Weight (Specific), % IACS 100
9.9

Otherwise Unclassified Properties

Base Metal Price, % relative 32
33
Density, g/cm3 9.0
8.9
Embodied Carbon, kg CO2/kg material 2.6
3.4
Embodied Energy, MJ/kg 42
51
Embodied Water, L/kg 350
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 66
6.5 to 160
Resilience: Unit (Modulus of Resilience), kJ/m3 250
290
Stiffness to Weight: Axial, points 7.2
7.7
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 8.6
11
Strength to Weight: Bending, points 11
12
Thermal Diffusivity, mm2/s 110
13
Thermal Shock Resistance, points 9.8
12

Alloy Composition


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Copper (Cu), % 99.89 to 99.966
84.7 to 90
Iron (Fe), % 0
1.0 to 1.8
Lead (Pb), % 0
0 to 0.050
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0
9.0 to 11
Oxygen (O), % 0 to 0.0010
0
Silver (Ag), % 0.034 to 0.060
0
Zinc (Zn), % 0
0 to 1.0
Residuals, % 0 to 0.050
0 to 0.5