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H01 C19200 Copper vs. H01 C73500 Nickel Silver

Both H01 C19200 copper and H01 C73500 nickel silver are copper alloys. Both are furnished in the H01 (quarter hard) temper. They have 72% of their average alloy composition in common. There are 25 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is H01 C19200 copper and the bottom bar is H01 C73500 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
130
Poisson's Ratio 0.34
0.33
Rockwell B Hardness 45
73
Shear Modulus, GPa 44
47
Tensile Strength: Ultimate (UTS), MPa 340
430

Thermal Properties

Latent Heat of Fusion, J/g 210
210
Maximum Temperature: Mechanical, °C 200
220
Melting Completion (Liquidus), °C 1080
1140
Melting Onset (Solidus), °C 1080
1090
Specific Heat Capacity, J/kg-K 390
400
Thermal Conductivity, W/m-K 240
36
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 67
6.5
Electrical Conductivity: Equal Weight (Specific), % IACS 68
6.7

Otherwise Unclassified Properties

Base Metal Price, % relative 30
35
Density, g/cm3 8.9
8.7
Embodied Carbon, kg CO2/kg material 2.6
4.0
Embodied Energy, MJ/kg 41
61
Embodied Water, L/kg 310
300

Common Calculations

Stiffness to Weight: Axial, points 7.2
8.0
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 11
14
Strength to Weight: Bending, points 12
15
Thermal Diffusivity, mm2/s 69
10
Thermal Shock Resistance, points 12
14

Alloy Composition


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Copper (Cu), % 98.5 to 99.19
70.5 to 73.5
Iron (Fe), % 0.8 to 1.2
0 to 0.25
Lead (Pb), % 0 to 0.030
0 to 0.1
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0
16.5 to 19.5
Phosphorus (P), % 0.010 to 0.040
0
Zinc (Zn), % 0 to 0.2
5.7 to 13
Residuals, % 0 to 0.2
0 to 0.5