H01 C26200 Brass vs. H01 C72800 Copper-nickel
Both H01 C26200 brass and H01 C72800 copper-nickel are copper alloys. Both are furnished in the H01 (quarter hard) temper. They have 69% of their average alloy composition in common. There are 30 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.
For each property being compared, the top bar is H01 C26200 brass and the bottom bar is H01 C72800 copper-nickel.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 110 | |
| 120 |
| Elongation at Break, % | 32 | |
| 13 |
| Poisson's Ratio | 0.31 | |
| 0.34 |
| Rockwell B Hardness | 55 | |
| 89 |
| Shear Modulus, GPa | 41 | |
| 44 |
| Shear Strength, MPa | 250 | |
| 370 |
| Tensile Strength: Ultimate (UTS), MPa | 430 | |
| 610 |
| Tensile Strength: Yield (Proof), MPa | 300 | |
| 520 |
Thermal Properties
| Latent Heat of Fusion, J/g | 180 | |
| 210 |
| Maximum Temperature: Mechanical, °C | 140 | |
| 200 |
| Melting Completion (Liquidus), °C | 950 | |
| 1080 |
| Melting Onset (Solidus), °C | 920 | |
| 920 |
| Specific Heat Capacity, J/kg-K | 390 | |
| 380 |
| Thermal Conductivity, W/m-K | 120 | |
| 55 |
| Thermal Expansion, µm/m-K | 20 | |
| 17 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 28 | |
| 11 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 31 | |
| 11 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 25 | |
| 38 |
| Density, g/cm3 | 8.2 | |
| 8.8 |
| Embodied Carbon, kg CO2/kg material | 2.7 | |
| 4.4 |
| Embodied Energy, MJ/kg | 45 | |
| 68 |
| Embodied Water, L/kg | 320 | |
| 360 |
Common Calculations
| Resilience: Ultimate (Unit Rupture Work), MJ/m3 | 120 | |
| 78 |
| Resilience: Unit (Modulus of Resilience), kJ/m3 | 420 | |
| 1170 |
| Stiffness to Weight: Axial, points | 7.2 | |
| 7.4 |
| Stiffness to Weight: Bending, points | 19 | |
| 19 |
| Strength to Weight: Axial, points | 14 | |
| 19 |
| Strength to Weight: Bending, points | 15 | |
| 18 |
| Thermal Diffusivity, mm2/s | 38 | |
| 17 |
| Thermal Shock Resistance, points | 14 | |
| 22 |
Alloy Composition
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| Aluminum (Al), % | 0 | |
| 0 to 0.1 |
| Antimony (Sb), % | 0 | |
| 0 to 0.020 |
| Bismuth (Bi), % | 0 | |
| 0 to 0.0010 |
| Boron (B), % | 0 | |
| 0 to 0.0010 |
| Copper (Cu), % | 67 to 70 | |
| 78.3 to 82.8 |
| Iron (Fe), % | 0 to 0.050 | |
| 0 to 0.5 |
| Lead (Pb), % | 0 to 0.070 | |
| 0 to 0.0050 |
| Magnesium (Mg), % | 0 | |
| 0.0050 to 0.15 |
| Manganese (Mn), % | 0 | |
| 0.050 to 0.3 |
| Nickel (Ni), % | 0 | |
| 9.5 to 10.5 |
| Niobium (Nb), % | 0 | |
| 0.1 to 0.3 |
| Phosphorus (P), % | 0 | |
| 0 to 0.0050 |
| Silicon (Si), % | 0 | |
| 0 to 0.050 |
| Sulfur (S), % | 0 | |
| 0 to 0.0025 |
| Tin (Sn), % | 0 | |
| 7.5 to 8.5 |
| Titanium (Ti), % | 0 | |
| 0 to 0.010 |
| Zinc (Zn), % | 29.6 to 33 | |
| 0 to 1.0 |
| Residuals, % | 0 to 0.3 | |
| 0 to 0.3 |