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H01 C36200 Brass vs. H01 C72800 Copper-nickel

Both H01 C36200 brass and H01 C72800 copper-nickel are copper alloys. Both are furnished in the H01 (quarter hard) temper. They have 62% of their average alloy composition in common.

For each property being compared, the top bar is H01 C36200 brass and the bottom bar is H01 C72800 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
120
Elongation at Break, % 20
13
Poisson's Ratio 0.31
0.34
Rockwell B Hardness 62
89
Shear Modulus, GPa 39
44
Shear Strength, MPa 230
370
Tensile Strength: Ultimate (UTS), MPa 390
610
Tensile Strength: Yield (Proof), MPa 340
520

Thermal Properties

Latent Heat of Fusion, J/g 170
210
Maximum Temperature: Mechanical, °C 120
200
Melting Completion (Liquidus), °C 900
1080
Melting Onset (Solidus), °C 890
920
Specific Heat Capacity, J/kg-K 380
380
Thermal Conductivity, W/m-K 120
55
Thermal Expansion, µm/m-K 21
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 26
11
Electrical Conductivity: Equal Weight (Specific), % IACS 28
11

Otherwise Unclassified Properties

Base Metal Price, % relative 23
38
Density, g/cm3 8.2
8.8
Embodied Carbon, kg CO2/kg material 2.6
4.4
Embodied Energy, MJ/kg 45
68
Embodied Water, L/kg 320
360

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 74
78
Resilience: Unit (Modulus of Resilience), kJ/m3 560
1170
Stiffness to Weight: Axial, points 6.9
7.4
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 13
19
Strength to Weight: Bending, points 14
18
Thermal Diffusivity, mm2/s 37
17
Thermal Shock Resistance, points 13
22

Alloy Composition


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Aluminum (Al), % 0
0 to 0.1
Antimony (Sb), % 0
0 to 0.020
Bismuth (Bi), % 0
0 to 0.0010
Boron (B), % 0
0 to 0.0010
Copper (Cu), % 60 to 63
78.3 to 82.8
Iron (Fe), % 0 to 0.15
0 to 0.5
Lead (Pb), % 3.5 to 4.5
0 to 0.0050
Magnesium (Mg), % 0
0.0050 to 0.15
Manganese (Mn), % 0
0.050 to 0.3
Nickel (Ni), % 0
9.5 to 10.5
Niobium (Nb), % 0
0.1 to 0.3
Phosphorus (P), % 0
0 to 0.0050
Silicon (Si), % 0
0 to 0.050
Sulfur (S), % 0
0 to 0.0025
Tin (Sn), % 0
7.5 to 8.5
Titanium (Ti), % 0
0 to 0.010
Zinc (Zn), % 32.4 to 36.5
0 to 1.0
Residuals, % 0
0 to 0.3