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C14200 Copper vs. Solder Alloy 811

C14200 copper belongs to the copper alloys classification, while solder alloy 811 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.

For each property being compared, the top bar is C14200 copper and the bottom bar is solder alloy 811.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
52
Elongation at Break, % 8.0 to 45
38
Poisson's Ratio 0.34
0.35
Shear Modulus, GPa 43
19
Tensile Strength: Ultimate (UTS), MPa 220 to 370
53

Thermal Properties

Latent Heat of Fusion, J/g 210
63
Melting Completion (Liquidus), °C 1080
200
Melting Onset (Solidus), °C 1030
190
Specific Heat Capacity, J/kg-K 390
230
Thermal Conductivity, W/m-K 190
59
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 45
14
Electrical Conductivity: Equal Weight (Specific), % IACS 45
17

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.3
Embodied Carbon, kg CO2/kg material 2.6
14
Embodied Energy, MJ/kg 41
240
Embodied Water, L/kg 310
1200

Common Calculations

Stiffness to Weight: Axial, points 7.2
4.0
Stiffness to Weight: Bending, points 18
17
Strength to Weight: Axial, points 6.8 to 11
2.0
Strength to Weight: Bending, points 9.1 to 13
4.3
Thermal Diffusivity, mm2/s 56
35
Thermal Shock Resistance, points 7.9 to 13
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0.15 to 0.5
0 to 0.030
Bismuth (Bi), % 0
2.8 to 3.2
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 99.4 to 99.835
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Phosphorus (P), % 0.015 to 0.040
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
87.8 to 89.7
Zinc (Zn), % 0
7.5 to 8.5