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C18700 Copper vs. ASTM Grade HG10 MNN Steel

C18700 copper belongs to the copper alloys classification, while ASTM grade HG10 MNN steel belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C18700 copper and the bottom bar is ASTM grade HG10 MNN steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
200
Elongation at Break, % 9.0 to 9.6
23
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 43
77
Tensile Strength: Ultimate (UTS), MPa 290 to 330
590
Tensile Strength: Yield (Proof), MPa 230 to 250
250

Thermal Properties

Latent Heat of Fusion, J/g 210
290
Maximum Temperature: Mechanical, °C 200
990
Melting Completion (Liquidus), °C 1080
1420
Melting Onset (Solidus), °C 950
1370
Specific Heat Capacity, J/kg-K 380
480
Thermal Conductivity, W/m-K 380
15
Thermal Expansion, µm/m-K 17
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 98
2.2
Electrical Conductivity: Equal Weight (Specific), % IACS 99
2.5

Otherwise Unclassified Properties

Base Metal Price, % relative 30
21
Density, g/cm3 9.0
7.8
Embodied Carbon, kg CO2/kg material 2.6
4.0
Embodied Energy, MJ/kg 41
58
Embodied Water, L/kg 310
160

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 24 to 29
110
Resilience: Unit (Modulus of Resilience), kJ/m3 240 to 280
160
Stiffness to Weight: Axial, points 7.1
14
Stiffness to Weight: Bending, points 18
25
Strength to Weight: Axial, points 9.0 to 10
21
Strength to Weight: Bending, points 11 to 12
20
Thermal Diffusivity, mm2/s 110
3.9
Thermal Shock Resistance, points 10 to 12
13

Alloy Composition

Carbon (C), % 0
0.070 to 0.11
Chromium (Cr), % 0
18.5 to 20.5
Copper (Cu), % 98 to 99.2
0 to 0.5
Iron (Fe), % 0
57.9 to 66.5
Lead (Pb), % 0.8 to 1.5
0
Manganese (Mn), % 0
3.0 to 5.0
Molybdenum (Mo), % 0
0.25 to 0.45
Nickel (Ni), % 0
11.5 to 13.5
Niobium (Nb), % 0
0.2 to 1.0
Nitrogen (N), % 0
0.2 to 0.3
Phosphorus (P), % 0
0 to 0.040
Silicon (Si), % 0
0 to 0.7
Sulfur (S), % 0
0 to 0.030
Residuals, % 0 to 0.5
0