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C55283 Copper vs. Solder Alloy 811

C55283 copper belongs to the copper alloys classification, while solder alloy 811 belongs to the otherwise unclassified metals. There are 17 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C55283 copper and the bottom bar is solder alloy 811.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
52
Poisson's Ratio 0.34
0.35
Shear Modulus, GPa 39
19
Tensile Strength: Ultimate (UTS), MPa 190
53

Thermal Properties

Latent Heat of Fusion, J/g 190
63
Melting Completion (Liquidus), °C 720
200
Melting Onset (Solidus), °C 640
190
Specific Heat Capacity, J/kg-K 400
230
Thermal Expansion, µm/m-K 16
22

Otherwise Unclassified Properties

Density, g/cm3 8.6
7.3
Embodied Carbon, kg CO2/kg material 7.9
14
Embodied Energy, MJ/kg 120
240

Common Calculations

Stiffness to Weight: Axial, points 6.8
4.0
Stiffness to Weight: Bending, points 18
17
Strength to Weight: Axial, points 6.1
2.0
Strength to Weight: Bending, points 8.5
4.3
Thermal Shock Resistance, points 8.0
3.3

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
2.8 to 3.2
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 86.2 to 87.2
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Phosphorus (P), % 7.0 to 7.5
0
Silver (Ag), % 5.8 to 6.2
0 to 0.1
Tin (Sn), % 0
87.8 to 89.7
Zinc (Zn), % 0
7.5 to 8.5
Residuals, % 0 to 0.15
0