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C55284 Copper vs. Solder Alloy 501

C55284 copper belongs to the copper alloys classification, while solder alloy 501 belongs to the otherwise unclassified metals. There are 17 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is C55284 copper and the bottom bar is solder alloy 501.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
51
Poisson's Ratio 0.34
0.36
Shear Modulus, GPa 38
19
Tensile Strength: Ultimate (UTS), MPa 180
29

Thermal Properties

Latent Heat of Fusion, J/g 180
60
Melting Completion (Liquidus), °C 800
230
Melting Onset (Solidus), °C 640
220
Specific Heat Capacity, J/kg-K 380
220
Thermal Expansion, µm/m-K 17
22

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.3
Embodied Carbon, kg CO2/kg material 16
15
Embodied Energy, MJ/kg 260
260

Common Calculations

Stiffness to Weight: Axial, points 6.5
3.8
Stiffness to Weight: Bending, points 18
17
Strength to Weight: Axial, points 5.6
1.1
Strength to Weight: Bending, points 8.0
2.9
Thermal Shock Resistance, points 7.4
1.9

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.060
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 79.2 to 80.7
0.5 to 0.9
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Phosphorus (P), % 4.8 to 5.2
0
Silver (Ag), % 14.5 to 15.5
0.2 to 0.4
Tin (Sn), % 0
98.3 to 99.3
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.15
0