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C68300 Brass vs. Solder Alloy 501

C68300 brass belongs to the copper alloys classification, while solder alloy 501 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.

For each property being compared, the top bar is C68300 brass and the bottom bar is solder alloy 501.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
51
Elongation at Break, % 15
22
Poisson's Ratio 0.31
0.36
Shear Modulus, GPa 40
19
Tensile Strength: Ultimate (UTS), MPa 430
29

Thermal Properties

Latent Heat of Fusion, J/g 180
60
Melting Completion (Liquidus), °C 900
230
Melting Onset (Solidus), °C 890
220
Specific Heat Capacity, J/kg-K 390
220
Thermal Conductivity, W/m-K 120
67
Thermal Expansion, µm/m-K 20
22

Otherwise Unclassified Properties

Density, g/cm3 8.0
7.3
Embodied Carbon, kg CO2/kg material 2.8
15
Embodied Energy, MJ/kg 46
260
Embodied Water, L/kg 340
1390

Common Calculations

Stiffness to Weight: Axial, points 7.3
3.8
Stiffness to Weight: Bending, points 20
17
Strength to Weight: Axial, points 15
1.1
Strength to Weight: Bending, points 16
2.9
Thermal Diffusivity, mm2/s 38
41
Thermal Shock Resistance, points 14
1.9

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0.3 to 1.0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.060
Cadmium (Cd), % 0 to 0.010
0 to 0.0020
Copper (Cu), % 59 to 63
0.5 to 0.9
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0 to 0.090
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Silicon (Si), % 0.3 to 1.0
0
Silver (Ag), % 0
0.2 to 0.4
Tin (Sn), % 0.050 to 0.2
98.3 to 99.3
Zinc (Zn), % 34.2 to 40.4
0 to 0.0010
Residuals, % 0 to 0.5
0