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C70400 Copper-nickel vs. Solder Alloy 811

C70400 copper-nickel belongs to the copper alloys classification, while solder alloy 811 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C70400 copper-nickel and the bottom bar is solder alloy 811.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
52
Poisson's Ratio 0.34
0.35
Shear Modulus, GPa 45
19
Tensile Strength: Ultimate (UTS), MPa 300 to 310
53

Thermal Properties

Latent Heat of Fusion, J/g 210
63
Melting Completion (Liquidus), °C 1120
200
Melting Onset (Solidus), °C 1060
190
Specific Heat Capacity, J/kg-K 390
230
Thermal Conductivity, W/m-K 64
59
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
14
Electrical Conductivity: Equal Weight (Specific), % IACS 14
17

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.3
Embodied Carbon, kg CO2/kg material 3.0
14
Embodied Energy, MJ/kg 47
240
Embodied Water, L/kg 300
1200

Common Calculations

Stiffness to Weight: Axial, points 7.5
4.0
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 9.3 to 9.8
2.0
Strength to Weight: Bending, points 11 to 12
4.3
Thermal Diffusivity, mm2/s 18
35
Thermal Shock Resistance, points 10 to 11
3.3

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
2.8 to 3.2
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 89.8 to 93.6
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 1.3 to 1.7
0 to 0.020
Lead (Pb), % 0 to 0.050
0 to 0.070
Manganese (Mn), % 0.3 to 0.8
0
Nickel (Ni), % 4.8 to 6.2
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
87.8 to 89.7
Zinc (Zn), % 0 to 1.0
7.5 to 8.5
Residuals, % 0 to 0.5
0