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C72150 Copper-nickel vs. Solder Alloy 501

C72150 copper-nickel belongs to the copper alloys classification, while solder alloy 501 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C72150 copper-nickel and the bottom bar is solder alloy 501.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 99
14
Elastic (Young's, Tensile) Modulus, GPa 150
51
Elongation at Break, % 29
22
Poisson's Ratio 0.33
0.36
Shear Modulus, GPa 55
19
Tensile Strength: Ultimate (UTS), MPa 490
29

Thermal Properties

Latent Heat of Fusion, J/g 250
60
Melting Completion (Liquidus), °C 1210
230
Melting Onset (Solidus), °C 1250
220
Specific Heat Capacity, J/kg-K 410
220
Thermal Conductivity, W/m-K 22
67
Thermal Expansion, µm/m-K 14
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.5
14
Electrical Conductivity: Equal Weight (Specific), % IACS 3.6
17

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.3
Embodied Carbon, kg CO2/kg material 6.1
15
Embodied Energy, MJ/kg 88
260
Embodied Water, L/kg 270
1390

Common Calculations

Stiffness to Weight: Axial, points 9.1
3.8
Stiffness to Weight: Bending, points 20
17
Strength to Weight: Axial, points 15
1.1
Strength to Weight: Bending, points 15
2.9
Thermal Diffusivity, mm2/s 6.0
41
Thermal Shock Resistance, points 18
1.9

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.060
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.1
0
Copper (Cu), % 52.5 to 57
0.5 to 0.9
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.1
0 to 0.020
Lead (Pb), % 0 to 0.050
0 to 0.070
Manganese (Mn), % 0 to 0.050
0
Nickel (Ni), % 43 to 46
0 to 0.010
Silicon (Si), % 0 to 0.5
0
Silver (Ag), % 0
0.2 to 0.4
Tin (Sn), % 0
98.3 to 99.3
Zinc (Zn), % 0 to 0.2
0 to 0.0010
Residuals, % 0 to 0.5
0