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C82800 Copper vs. C19200 Copper

Both C82800 copper and C19200 copper are copper alloys. They have a very high 96% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C82800 copper and the bottom bar is C19200 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 1.0 to 20
2.0 to 35
Poisson's Ratio 0.33
0.34
Rockwell B Hardness 45 to 85
38 to 76
Shear Modulus, GPa 46
44
Tensile Strength: Ultimate (UTS), MPa 670 to 1140
280 to 530
Tensile Strength: Yield (Proof), MPa 380 to 1000
98 to 510

Thermal Properties

Latent Heat of Fusion, J/g 240
210
Maximum Temperature: Mechanical, °C 310
200
Melting Completion (Liquidus), °C 930
1080
Melting Onset (Solidus), °C 890
1080
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 120
240
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 18
58 to 74
Electrical Conductivity: Equal Weight (Specific), % IACS 19
58 to 75

Otherwise Unclassified Properties

Density, g/cm3 8.7
8.9
Embodied Carbon, kg CO2/kg material 12
2.6
Embodied Energy, MJ/kg 190
41
Embodied Water, L/kg 310
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11 to 110
10 to 98
Resilience: Unit (Modulus of Resilience), kJ/m3 590 to 4080
42 to 1120
Stiffness to Weight: Axial, points 7.8
7.2
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 21 to 36
8.8 to 17
Strength to Weight: Bending, points 20 to 28
11 to 16
Thermal Diffusivity, mm2/s 36
69
Thermal Shock Resistance, points 23 to 39
10 to 19

Alloy Composition


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Aluminum (Al), % 0 to 0.15
0
Beryllium (Be), % 2.5 to 2.9
0
Chromium (Cr), % 0 to 0.1
0
Cobalt (Co), % 0.15 to 0.7
0
Copper (Cu), % 94.6 to 97.2
98.5 to 99.19
Iron (Fe), % 0 to 0.25
0.8 to 1.2
Lead (Pb), % 0 to 0.020
0 to 0.030
Nickel (Ni), % 0 to 0.2
0
Phosphorus (P), % 0
0.010 to 0.040
Silicon (Si), % 0.2 to 0.35
0
Tin (Sn), % 0 to 0.1
0
Titanium (Ti), % 0 to 0.12
0
Zinc (Zn), % 0 to 0.1
0 to 0.2
Residuals, % 0 to 0.5
0 to 0.2