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C97400 Nickel Silver vs. Solder Alloy 201

C97400 nickel silver belongs to the copper alloys classification, while solder alloy 201 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C97400 nickel silver and the bottom bar is solder alloy 201.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 70
13
Elastic (Young's, Tensile) Modulus, GPa 120
50
Elongation at Break, % 20
38
Poisson's Ratio 0.33
0.35
Shear Modulus, GPa 44
19
Tensile Strength: Ultimate (UTS), MPa 260
41

Thermal Properties

Latent Heat of Fusion, J/g 190
64
Melting Completion (Liquidus), °C 1100
240
Melting Onset (Solidus), °C 1070
240
Specific Heat Capacity, J/kg-K 380
220
Thermal Conductivity, W/m-K 27
28
Thermal Expansion, µm/m-K 18
21

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
12
Electrical Conductivity: Equal Weight (Specific), % IACS 6.3
15

Otherwise Unclassified Properties

Density, g/cm3 8.6
7.3
Embodied Carbon, kg CO2/kg material 4.1
15
Embodied Energy, MJ/kg 64
250
Embodied Water, L/kg 320
1320

Common Calculations

Stiffness to Weight: Axial, points 7.5
3.8
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 8.5
1.6
Strength to Weight: Bending, points 11
3.6
Thermal Diffusivity, mm2/s 8.3
17
Thermal Shock Resistance, points 8.8
2.7

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
4.5 to 5.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 58 to 61
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 1.5
0 to 0.020
Lead (Pb), % 4.5 to 5.5
0 to 0.070
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 15.5 to 17
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 2.5 to 3.5
94 to 95.5
Zinc (Zn), % 10 to 19.5
0 to 0.0010
Residuals, % 0 to 1.0
0