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C99300 Copper vs. Solder Alloy 713

C99300 copper belongs to the copper alloys classification, while solder alloy 713 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C99300 copper and the bottom bar is solder alloy 713.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 200
15
Elastic (Young's, Tensile) Modulus, GPa 120
51
Elongation at Break, % 2.0
16
Poisson's Ratio 0.33
0.36
Shear Modulus, GPa 46
19
Tensile Strength: Ultimate (UTS), MPa 660
59

Thermal Properties

Latent Heat of Fusion, J/g 240
62
Melting Completion (Liquidus), °C 1080
220
Melting Onset (Solidus), °C 1070
220
Specific Heat Capacity, J/kg-K 450
220
Thermal Conductivity, W/m-K 43
60
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.0
13
Electrical Conductivity: Equal Weight (Specific), % IACS 9.8
16

Otherwise Unclassified Properties

Density, g/cm3 8.2
7.4
Embodied Carbon, kg CO2/kg material 4.5
18
Embodied Energy, MJ/kg 70
300

Common Calculations

Stiffness to Weight: Axial, points 8.3
3.8
Stiffness to Weight: Bending, points 20
17
Strength to Weight: Axial, points 22
2.2
Strength to Weight: Bending, points 20
4.5
Thermal Diffusivity, mm2/s 12
36
Thermal Shock Resistance, points 22
3.7

Alloy Composition


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Aluminum (Al), % 10.7 to 11.5
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Cobalt (Co), % 1.0 to 2.0
0
Copper (Cu), % 68.6 to 74.4
0.5 to 0.9
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.4 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.020
0 to 0.070
Nickel (Ni), % 13.5 to 16.5
0 to 0.010
Silicon (Si), % 0 to 0.020
0
Silver (Ag), % 0
3.6 to 4.0
Tin (Sn), % 0 to 0.050
94.6 to 95.9
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.3
0