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N08330 Stainless Steel vs. C17300 Copper

N08330 stainless steel belongs to the iron alloys classification, while C17300 copper belongs to the copper alloys. There are 28 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is N08330 stainless steel and the bottom bar is C17300 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 200
120
Elongation at Break, % 34
3.0 to 23
Poisson's Ratio 0.28
0.33
Shear Modulus, GPa 76
45
Shear Strength, MPa 360
320 to 790
Tensile Strength: Ultimate (UTS), MPa 550
500 to 1380
Tensile Strength: Yield (Proof), MPa 230
160 to 1200

Thermal Properties

Latent Heat of Fusion, J/g 310
230
Maximum Temperature: Mechanical, °C 1050
270
Melting Completion (Liquidus), °C 1390
980
Melting Onset (Solidus), °C 1340
870
Specific Heat Capacity, J/kg-K 480
380
Thermal Conductivity, W/m-K 12
110
Thermal Expansion, µm/m-K 16
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 1.7
22
Electrical Conductivity: Equal Weight (Specific), % IACS 1.9
23

Otherwise Unclassified Properties

Density, g/cm3 8.0
8.8
Embodied Carbon, kg CO2/kg material 5.4
9.4
Embodied Energy, MJ/kg 77
150
Embodied Water, L/kg 190
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 150
40 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 140
110 to 5410
Stiffness to Weight: Axial, points 14
7.6
Stiffness to Weight: Bending, points 24
19
Strength to Weight: Axial, points 19
16 to 44
Strength to Weight: Bending, points 18
16 to 31
Thermal Diffusivity, mm2/s 3.1
32
Thermal Shock Resistance, points 13
17 to 48

Alloy Composition


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Aluminum (Al), % 0
0 to 0.2
Beryllium (Be), % 0
1.8 to 2.0
Carbon (C), % 0 to 0.080
0
Chromium (Cr), % 17 to 20
0
Copper (Cu), % 0 to 1.0
95.5 to 97.8
Iron (Fe), % 38.3 to 48.3
0 to 0.4
Lead (Pb), % 0 to 0.0050
0.2 to 0.6
Manganese (Mn), % 0 to 2.0
0
Nickel (Ni), % 34 to 37
0.2 to 0.6
Phosphorus (P), % 0 to 0.030
0
Silicon (Si), % 0.75 to 1.5
0 to 0.2
Sulfur (S), % 0 to 0.030
0
Tin (Sn), % 0 to 0.025
0
Residuals, % 0
0 to 0.5